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Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust

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Buy cheap Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust from wholesalers
  • Buy cheap Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust from wholesalers
  • Buy cheap Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust from wholesalers

Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust

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Brand Name:LEFANG
Model Number:RM0004L134
Certification:ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Price:Negotiable
Payment Terms:T/T, Western Union, Paypal, MoneyGram
Supply Ability:290, 000 sqm Per Month
Delivery Time:2-10 work days
Company Data
Active Member
Contact Person Cyan Hong
Business Type: 86--18926003312
Business Type: Manufacturer
Officials: A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway
Quality: Quality Certifitation Available
Product Details Company Profile
Product Details

Gold Immersion Multilayer PCB Board for ASIC Communication Printed Circuit Board


The Multilayer PCB Board is applied to communication device, which is a 4 layers multilayer PCB board. The specification of the PCB board is 37 * 37 mm, with green solder mask and OSP surface treatment.


Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust


What We Can Do for You?
Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust
With over 18 years experience, we offer OEM & ODM PCB Layout, PCB Design, PCB manufacturing and
PCB Assembly in single-sided PCB Board, double-sided PCB and Multilayer Printed Circuit Board service to
our customers, with total production capacity of 290,000 sqm/month.

How to get quick quotation?

Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust


Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.


SAMPLE:


Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k


Lead Time
Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust
Layer countSample lead time/workdayBatch lead time/workday
1-2L26
4L58
6L59
8L610
10L810
12L812
14L1015
16L1018
18-40L (Up to difficulty)at least 18at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

How to guarantee our high quality products?
Gold Plated PCB Board Multilayer , ASIC PCB Board For Communication Anti Rust

-- We employ 70 professional engineers to ensure our high quality products.


DepartmentHeadcount
Electronic Eng.13
R&D Eng.15
PE Eng.10
CAM Eng.26
MI Eng.6


Now send us your inquiry, and you will be replied within 8 hours!


Little knowledge - Double Sided PCB

Double Sided PCBs also known as Double-Sided Plated Thru or DSPT, which are the gateway to higher technology applications compared to single sided PCB.

Double Sided PCB allow for the routing of traces around each other by jumping between a top and bottom layer by way of vias.

The ability to cross paths from top to bottom greatly increasing the circuit designer's flexibility in circuits designing and lends itself to greatly increased circuit densities.

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